Heterogeneous photonic integrated circuits
Gunther Roelkens, Ghent University - imec, Belgium
Martijn Heck, TU/e, Netherlands
SC3 – Photonic Integrated Circuits, Assemblies & Packaging
SC2 – Photonic Devices & Technologies
Day & Time
18.09.2022, 09:00 – 12:30
This workshop will discuss the technologies for heterogeneous photonic integrated circuits and the applications requiring them. The strengths and weaknesses of the different technologies are addressed and a match will be sought between current/future applications & existing technologies.
Session 1: Technologies (90 min, 10 min per speaker + 30 min discussion)
Photonic Multi-Chip Integration Enabled by Photonic Wire Bonds (PWB) and 3D-Printed Microlenses, Sebastian Skacel, Vanguard Automation GmbH, Germany
High-Precision Flip-Chip Bonding of InP Lasers on Silicon Photonics, Joris Van Campenhout, imec, Belgium
Challenges and Advantages of III-V Integration in a Foundry Environment, Oleg Martynov, Tower Semiconductor, USA
Micro Transfer Printing to Allow for Heterogenous Components Integrated on a Single Substrate, David Gomez, X-Celeprint, USA
Heterogeneous Integration of Quantum Dot Photonics for Optical Connectivity, Alan Liu, Quintessent, USA
III-V active devices selectively grown on patterned SOI by lateral MOCVD, Kei May Lau, Chinese University of Hong Kong, Hong Kong
Coffee Break (30 min)
Session 2: Applications (90 min, 10 min per speaker + 30 min discussion)
Heterogenous Photonic Integration for Datacom and Optical Sensor Applications, Jonathan Doylend, Intel, USA
Hybrid lasers and electro-absorption modulators in multi-micron waveguide silicon photonics and their applications, Hua Yang, Rockley Photonics, Ireland
2.X um GaSb/Si laser spectrometers, Augustinas Vizbaras, BROLIS, Lithuania
Requirements for heterogeneous photonic integrated circuits for modern automotive LIDAR, Stanislav Aksarin, Scantinel, Germany
Heterogeneous Photonics at DARPA, Gordon Keeler, DARPA, USA
Heterogeneous integration for single-photon quantum technologies, Leonardo Midolo, Niels Bohr Institute, Denmark
Speaker 1: Sebastian Skacel, Vanguard Automation GmbH, Germany
Title: Photonic Multi-Chip Integration Enabled by Photonic Wire Bonds (PWB) and 3D-Printed Microlenses
Abstract: Photonic wire bonding allows to combine the complementary strengths of different optical integration platforms in advanced photonic multi-chip modules leading to compactness with high performance and great design flexibility. The technique relies on highly precise direct-write 3D laser lithography for printing of freeform single-mode waveguides between optical dies, thereby offering a path towards fully automated mass production without the need for active alignment. 3D nano-printing can also be used to fabricate facet-attached beam-shaping elements on optical chips and fibers, allowing for low-loss coupling with high alignment tolerance and for wafer-level probing of optical devices.
Biography: Sebastian Skacel is Head of Applications Engineering, Support and Services at Vanguard Automation GmbH, overseeing customer engagements including technical demonstrations, delivery of products and solutions as well as customer success. He also spearheads many of Vanguard’s business development and strategic marketing efforts. Prior to joining Vanguard, Sebastian worked in academia as well as in the automotive industry (Harman International) in Germany, the United Kingdom, Italy, and Russia. Sebastian holds a PhD (Dr. rer. nat.) degree in Physics from Karlsruhe Institute of Technologies (KIT) for which he was granted a scholarship of the Heinrich Böll Foundation. His PhD was in the field of superconducting quantum circuits such as qubits.
Speaker 2: Joris Van Campenhout, imec, Belgium
Title: High-Precision Flip-Chip Bonding of InP Lasers on Silicon Photonics
Abstract: We discuss recent progress at imec in wafer-scale flip-chip assembly of InP DFB lasers on silicon photonics. By leveraging an advanced vision-driven dynamic alignment pick-and-place tool with laser-assisted reflow bonding capability, an in-plane alignment precision well below 300 nm (mean+3σ) is achieved, in a total bonding cycle time of just 25s. Optical butt-coupling efficiencies of 1.5+-/0.5dB to SiN waveguide are routinely achieved without the need for multi-micron spot-size convertors in the InP components.
Biography: Joris Van Campenhout is Fellow Silicon Photonics and Director of the industry-affiliation R&D program on Optical I/O at imec (Belgium), which aims to scale optical interconnects to bandwidth densities well beyond 1Tbps/mm, while consuming less power than 1pJ/bit. Prior to joining imec in 2010, Joris was a post-doctoral researcher at IBM’s TJ Watson Research Center (USA), and he obtained a PhD degree from Ghent University in 2007, for his work on heterogeneous integration of InP microlasers on silicon. Joris has co-authored 12 issued patents and over 100 papers in the field of silicon integrated photonics, which have received 10000+ citations.
Speaker 3: Oleg Martynov, Tower Semiconductor, USA
Title: Challenges and Advantages of III-V Integration in a Foundry Environment
Abstract: Heterogeneous integration of optical gain materials with traditional silicon VLSI manufacturing provides an avenue for previously unrealized photonic devices and products. Utilizing die-to-wafer bonding of III-V materials to a partially processed silicon photonics wafer enables light generation and manipulation within a single process flow, providing a wide variety of technological advantages. The opportunities and engineering challenges of this new area of development are discussed from a high-volume manufacturing foundry point of view.
Biography: Oleg Martynov received his B.S. degree in Physics from Oakland University. He then earned his M.S. and Ph.D. in Physics from the University of California, Riverside (UCR). Following a brief postdoc at UCR, Dr. Martynov joined Tower Semiconductor in 2017 as a Process Development Engineer. Since then, he has been promoted to manager overseeing silicon photonics technology development. Dr. Martynov and his team have focused on traditional silicon photonics as well as III-V heterogenous integration in high-volume production, and he has shared his work though publications, presentations, and patents.
Speaker 4: David Gomez, X-Celeprint, USA
Title: Micro Transfer Printing to Allow for Heterogenous Components Integrated on a Single Substrate
Abstract: Micro-Transfer Printing (MTP) is a mass transfer process that provides fast and precise assembly of micro-components onto non-native substrates. The process involves the fabrication of retrievable x-chips, elastomer stamp retrieval, transfer-printing of the x-chips to a non-native substrate, and finally electrical interconnection. Micro-components have been fabricated out of Si IC wafers, as well as multiple III-V materials including InP, GaAs, and GaN to create components such as lasers, optical amplifiers, photo diodes, LEDs and more. The process is notable for its ability to transfer small and thin devices in a materials-agnostic fashion with accuracy of 0.75 μm 3-sigma and transfer yields exceeding 99%.
Biography: David Gomez is Sr Director of Engineering for X-Celeprint. In this role he manages the team that works to further develop the Micro Transfer Printing technology for various custom applications for specific customers. David spent the first 15 years of his career working in high volume manufacturing facilities working for Freescale and Qimonda. Within that time has held positions both as an engineer and an engineering manager. He has spent the last 13 years working on managing and improving the micro-transfer print process both at Semprius and X-Celeprint. David has a Bachelors Degree in Materials Science from the Massachusetts Institute of Technology.
Speaker 5: Alan Liu, Quintessent, USA
Title: Heterogeneous Integration of Quantum Dot Photonics for Optical Connectivity
Abstract: Modern computing applications such as AI/ML require the collective computing resources of entire racks or clusters. Communication between compute chips (XPUs) is a critical rate limiting step in such large-scale synchronous computing workloads, in addition to being a significant – and growing - portion of the total system power consumption. Quintessent is leveraging quantum dot photonics and heterogeneous integration to develop connectivity solutions that are capable of matching the progression of bandwidth, power, and latency scaling from XPU interfaces to enable distance agnostic compute fabrics and new system architectures.
Biography: Alan Liu is currently CEO and co-founder of Quintessent, where he works alongside a stellar team commercializing optical connectivity solutions to remove data movement bottlenecks in accelerated computing clusters and datacenters. He was previously a consultant at Booz Allen Hamilton and advised on various photonics R&D programs for clients at DARPA and ARPA-E. Alan obtained his PhD from Professor John Bowers’ group at UCSB where he performed research on quantum dot lasers for silicon photonics.
Speaker 6: Kei May Lau, Chinese University of Hong Kong, Hong Kong
Title: III-V active devices selectively grown on patterned SOI by lateral MOCVD
Abstract: To efficiently couple light between active and passive components for Si photonics, we developed the lateral aspect ratio trapping (LART) technology to grow lasers and high-speed photodetectors on patterned commercial SOI substrates for integrated Si photonics. Multimode and single-mode lasing from lateral quantum wells (QWs) as the gain media using LART have been achieved in the 1433 -1630 nm band with varying dimensions of micro-ring lasers. High-performance PDs were also constructed on the monolithic InP/SOI platform with laterally grown p-i-n structures and show open eye diagram exceeding 40 Gb/s.
Biography: Kei May Lau is a Research Professor of Electronic Engineering at the Chinese University of Hong Kong (CUHK). She served as a faculty member at the University of Massachusetts/Amherst and Hong Kong University of Science & Technology. She is a Fellow of the IEEE, Optica, and the Hong Kong Academy of Engineering Sciences, a recipient of the IET J J Thomson medal for Electronics, OSA Nick Holonyak Jr. Award, and IEEE Photonics Society Aron Kressel Award. Lau’s research work is focused on the development of monolithic integration of semiconductor devices on industry-standard silicon and SOI substrates.
Speaker 7: Jonathan Doylend, Intel, USA
Title: Heterogenous Photonic Integration for Datacom and Optical Sensor Applications
Abstract: Both datacom and optical sensor applications increasingly require the dense integration in a photonic integrated circuit of multiple optical components including lasers, amplifiers, phase and amplitude control, low-noise photodiodes, and mode converters. These must further be integrated in a compact form factor that can be manufactured in high volume. This talk will examine various approaches to enable such integration on a silicon chip in a scalable high-volume manufacturing process.
Biography: Jonathan Doylend received the B.Sc. in Physics from the University of Waterloo and Ph.D. in Engineering Physics from McMaster University, Canada. Subsequently he joined the University of California, Santa Barbara, as an NSERC Post-Doctoral Fellow where he demonstrated the first beam-steered silicon photonic hybrid laser. Currently he is a Senior Principal Engineer in the Silicon Photonics Product Division at Intel Corporation and is the Technical Lead of Intel’s Silicon Photonics LIDAR program.
Speaker 8: Hua Yang, Rockley Photonics, Ireland
Title: Hybrid lasers and electro-absorption modulators in multi-micron waveguide silicon photonics and their applications
Abstract: Silicon photonics is now widely regarded as the key technology to bring planarized photonic integrated circuits to a wide range of applications through efficient integration of III-V materials into silicon photonics to enable active components such as lasers and modulators. Here we review the demands of silicon PICs with hybrid III-V in datacenter and consumer applications and specifically the solutions of hybrid lasers and electro-absorption modulators efficiently integrated into the multi-micron silicon waveguide platform through edge-coupling techniques. The lasers have >40dB SMSR, >50mW waveguide output power, and 15% wall plug efficiency. The modulators have good 106Gb/s PAM-4 performance with TDECQ of 2.67 dB and ERs of 4.9 dB at varying temperatures up to 65C in O-band.
Biography: Hua Yang is a senior R&D manager at Rockley Photonics Ireland, leading the development of next generation III-V components and hybrid integration of III-V with silicon. Before joining Rockley in 2018 he worked on research and development of III-V components and photonics integrated circuits as a research fellow in Nanyang Technological University, Singapore, and then as a senior staff researcher in Tyndall National Institute, Ireland. Hua received the Ph.D. degree in optoelectronics from the Institute of Semiconductors, CAS, Beijing, in 2006.
Speaker 9: Augustinas Vizbaras, BROLIS, Lithuania
Title: 2.X µm GaSb/Si laser spectrometers
Abstract: GaSb-based optoelectronic devices combined with silicon photonic integrated circuits offer an attractive platform for spectroscopic sensing beyond telecom wavelengths i.e. > 1.7 micron. This spectral region offers access to 1st overtone and combination molecular vibrational absorption bands with high molar absorptivity and importantly high specificity. GaSb/Si laser spectrometers developed at BROLIS can be seen as a generic spectroscopic platform suitable for both liquid phase and gas phase sensing, as the architecture allows both wide spectral sweep ( > 300 nm), required for spectrally broad liquid samples as well as continuous mode-hop-free tuning across several nm, suitable for gas phase samples.
Biography: Augustinas Vizbaras – co-founder and co-CTO of BROLIS. Field of expertise encompasses long-wavelength III-V and III-V/Si optoelectronic devices and systems. Augustinas has BSc in EE from Vilnius University (Lithuania), MSc in Physics from Royal Institute of Technology (Sweden) and was a doctoral candidate at Technische Universität München (Germany) prior starting BROLIS. He has authored and co-authored more than 50 publications in leading scientific technical journals and conference proceedings. Augustinas is a member of the Council at Vilnius University and a member of Scientific Advisory Board at CSEM (Switzerland). Augustinas has 7 granted international patents and around 50 pending.
Speaker 10: Stanislav Aksarin, Scantinel, Germany
Title: Requirements for heterogeneous photonic integrated circuits for modern automotive LIDAR
Abstract: Today, the heterogeneous integration of photonics components enables scalable and low-cost solutions supporting the demand for automotive LiDAR applications. However, due to the complexity of combing III-V materials within a low-loss Si/SiN photonics platform, the complete substitution of existing discrete components is a challenge. This workshop aims to share knowledge and understanding of the manufacturing limitations and characteristics of lasers, detectors and passive components to enhance and optimize the functionality of heterogeneously integrated photonic devices for the needs of the LiDAR industry.
Biography: Stanislav Aksarin received his PhD in Physics and Mathematics sciences in Optics at ITMO University, Russia, in 2014. Since 2015, he has been the head of the Laboratory for Optical Packaging of Light-Guided Devices, and in 2020 he received the position of Associate Professor. In 2021, he moved into the LiDAR industry and is working now as a Senior Laser and Amplifier Specialist in the R&D department of Scantinel Photonics. Throughout his scientific career, he has been developing photonics sensing systems focusing on the practical aspect of adapting photonics components in industrial applications.
Speaker 11: Gordon Keeler, DARPA, USA
Title: Heterogeneous Photonics at DARPA
Abstract: The heterogeneous integration of diverse materials promises a new generation of photonics with transformative advantages over existing platforms. While advances in silicon, silica, and silicon nitride photonics allow excellent scalability and low loss, the addition of new materials is key to enabling on-chip optical gain across the spectrum, efficient nonlinear photonics, non-reciprocity, and strong light-matter interaction for fast, compact active components. This talk describes efforts at DARPA to advance optical microsystem technologies for computing, sensing, quantum systems, and precision frequency control by highlighting the LUMOS, PIPES, and GRYPHON programs.
Biography: Dr. Gordon Keeler is a program manager at the Defense Advanced Research Projects Agency (DARPA), where his programs seek to accelerate the development of emerging electronics, photonics, and integration technologies and enable revolutionary microsystems. Previously, he worked at Sandia National Laboratories with a research focus on compound semiconductor optoelectronics and heterogeneous integration techniques for optical sensing, imaging, communications, and high-performance computing. He has co-authored more than 150 peer-reviewed publications and proceedings, and holds several patents in the field of photonics. He received the MS and PhD degrees in Applied Physics from Stanford University.
Speaker 12: Leonardo Midolo, Niels Bohr Institute, Denmark
Title: Heterogeneous integration for single-photon quantum technologies
Abstract: Single photons from semiconductor quantum dots are key asset for quantum communication, quantum simulation, and information processing. In this talk, I will illustrate the challenges in scaling up photonic quantum hardware based on photons, and how heterogenous photonic integrated circuits could provide an excellent path forward in developing a robust and versatile platform for quantum technologies.
Biography: Leonardo Midolo received his PhD in 2013 from Eindhoven University of Technology. He then moved to Denmark, where he joined the Niels Bohr Institute in Copenhagen and, in 2020, became Associate Professor in experimental quantum photonics. He holds an ERC starting grant to investigate nanomechanical quantum photonic integrated circuits.